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Published: 2024-06-22 10:00:21.628917 Category: Technology Type: Illustration Model release: No
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Close-up of a semiconductor wafer device after the dicing process. The silicon mold is being extracted by a pick and place machine. computer chip production

Contributor: atitaph
ID : 858988938
TitleFilesize
Illustration5824x3264


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Keywords
semiconductor, wafer, device, dicing, silicon, molded, extraction, pecking, place, machine, computer, chips, production, closeup, technology, manufacturing, electronic, microchip, processor, circuit, precision, industry, assembly, robotic, automation, equipment, fabrication, engineering, high technology, hardware, component, microelectronics, industrial, operation, machinery, integrated, detailed, mechanism, assembly line, intricate, modern, advanced, automated, process


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