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Published: 2025-02-13 07:52:34.593743 Category: Graphic Resources Type: Photo Model release: No
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Engineers are analyzing thermal conductivity properties of new chip materials.

Contributor: Papisut
ID : 1262062800
TitleFilesize
Photo5824x3264


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Keywords
engineer, canvasses, thermal, property, new, chips, material, test, performance, laboratory, enhancement, mechanic, industry, semiconductor, evaluation, formulation, development, interaction, advancement, integration, equipment, validation, innovation, assessment, electrical, solution, microchip, efficiency, technology, prototype, component, comparison, characteristic, simulation, experiment, application, quality, fabrication, exploration


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