Silicon Dies are being Extracted by a Pick and Place Machine from Wafer and Attached to Substrate. Computer Chip Manufacturing at Factory. Close-up of Semiconductor Packaging Process.

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Published: 2025-03-28 10:39:09.145130 Category: Industry Type: Illustration Model release: No

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Contributor: Cavad

ID : 1367575456

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Keywords

wafer, chips, semiconductor, silicon, nanotechnology, industry, fabrication, lithography, industrial, electronic, science, foundry, advanced, equipment, facility, device, shortage, technology, circuit, robotic, transistor, computer, microchip, factory, photolithography, development, arm, production, component, line, manufacturing, cardboard box, central processing unit, integrated, disc, process, memory, constructed, machine, die, package, processor, controller

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