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Published: 2023-02-27 14:44:25.591754 Category: Technology Type: Photo Model release: Yes
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Silicon Dies are being Extracted by a Pick and Place Machine from Wafer and Attached to Substrate. Computer Chip Manufacturing at Factory. Close-up of Semiconductor Packaging Process.

Contributor: IM Imagery
ID : 575964572
TitleFilesize
Photo6400x3600


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Keywords
computer, chips, wafer, processor, central processing unit, silicon, electronic, semiconductor, circuit, microchip, integrated, controller, arm, transistor, disc, cardboard box, package, factory, foundry, manufacturing, production, facility, equipment, nanotechnology, photolithography, lithography, industry, industrial, machine, fabrication, constructed, device, process, shortage, memory, line, development, component, robotic, technology, advanced, science, research, die


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